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WEEKLY NEWS
Last Updated: 10 June 2010
 
POLICY

TRAI extends last date to receive comments on Pre Consultation on “Encouraging Telecom Equipments Manufacturing”
June11, 2010


Telecom Regulatory Authority of India (TRAI) had invited comments of stakeholders for pre-consultation on “Encouraging Telecom Equipments Manufacturing” on 6th May, 2010. The last date for receiving comments was fixed as 8th June, 2010. Some stakeholders have requested for further extension of time for sending their comments. In view of this, the Authority has decided to extend the last date for submission of written comments by all stakeholders up to 30th June, 2010. Stakeholders are requested to submit their comments before this date preferably in electronic form at cn@trai.gov.in or srocn1@trai.gov.in.

TRAI Issues Consultation Paper on ‘National Broadband Plan’
June 10, 2010


The Telecom Regulatory Authority of India (TRAI) issued a consultation paper on ‘National Broadband Plan”. Availability of Broadband services at affordable tariff will provide access to enormous information, facilitate delivery of civic services, increase GDP contributions, generate more employment and enhance productivity.

Department of Telecom (DoT) has made a reference to TRAI seeking its recommendations on the need to review the definition of Broadband connectivity in view of future growth in internet/broadband driven by wireless technologies.

It is a matter of concern that broadband penetration in India is low in spite of the fact that 104 telecom service providers are providing broadband services. Though 70% of Indian population lives in rural areas; broadband facility is limited to metro and major cities. Out of total 9.0 million broadband subscribers at the end of April 2010, just 5% are in rural areas.

For making all villages broadband enabled, an option being explored is taking optical fibre to 375,552 villages having population of 500 or more. Such a network would require laying of about 12 billion kilometres of optical fibre at a cost of about Rs. 323 billion.

In order to initiate focused discussion on all the pertinent issues regarding growth of broadband, the Authority has issued this consultation paper. Stakeholders are requested to send their comments on the consultation paper by 7th July 2010. Comments will be posted on TRAI’s website as and when they are received. Counter comments, if any, to the comments received may be sent to TRAI by 15th July 2010. This consultation paper is available on TRAI’s website www.trai.gov.in

DoT initiates to look at TRAI's 2G spectrum proposals
June 3, 2010


Although TRAI's recommendations on pricing of 2G spectrum and refarming is going to be available only after the month of July, the Department of Telecom(DoT) has asked its main divisions to look into TRAI's other proposals on the mobile radiowaves.

As per DoT, work has to start on the regulator's host of proposals on 2G spectrum pricing even as TRAI's further recommendations on the 2G spectrum pricing (linking 3G spectrum price to 2G) and refarming of spectrum in 800/900 Mhz band may take some time to be in place.


 

INDUSTRY

Gartner: The Semiconductor Equipment Spending to Grow 113 % in 2010
June 10, 2010


Worldwide semiconductor capital equipment spending is projected to surpass US$ 35.4 billion in 2010, a 113.2 % increase from 2009 spending of US$ 16.6 billion, according to Gartner, Inc. However, Gartner warned that equipment vendors should prepare for slower growth heading into 2011. Worldwide semiconductor capital equipment spending will grow 6.6 % in 2011.

The wafer fabrication equipment (WFE) segment is expected to increase 113.3 % in 2010, followed by 7.2 % growth in 2011. As per Gartner prediction, the packaging and assembly equipment (PAE) segment will increase 104.7 % in 2010 and grow a nominal 0.7 % in 2011. Whereas, the worldwide automated test equipment (ATE) market is expected to rise by more than 133 % in 2010.




TECHNOLOGY

Microchip announces certified embedded Wi-Fi transceiver modules with easier API interface to PIC microcontrollers
June 9, 2010


Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, has announced its next-generation, agency-certified MRF24WB0MA/MB embedded Wi-Fi transceiver modules. The IEEE 802.11 module firmware has an easy-to-use API driver interface to Microchip's free TCP/IP Protocol stack and 8-, 16- or 32-bit PIC® microcontrollers.

Embedded designers are increasingly leveraging the ubiquitous Wi-Fi infrastructure to enable wireless communication in a broad range of remote monitoring and control, and machine-to-machine applications, such as smart-energy monitors.

The MRF24WB0MA/MB embedded Wi-Fi modules are available via any Microchip sales representative or authorized worldwide distributor, or at Microchip's e-commerce Web site: http://www.microchip.com/get/NNET.

ON Semiconductor Introduces Linear Regulator and Controller for Automotive Lighting
June 3, 2010


ON Semiconductor (Nasdaq: ONNN) a premier supplier of high performance, energy efficient silicon solutions for green electronics has announced the release of a linear regulator and controller. The NCV7680 consists of eight linear programmable constant current sources. It is designed for use in the regulation and control of solid state rear combination lamps of vehicles, and is capable of supporting an LED driving current of up to 75 mA per channel.

Due to its high degree of integrated functionality, the NCV7680 allows support for two brightness levels - one for stop and one for tail illumination. Optional pulse width modulation (PWM) control can also be implemented if required. System designers can set the output current (global set point) with the use of just one external resistor. An optional external ballast FET allows for power distribution on designs requiring high currents.

The NCV7680 is offered in a SOIC-16 Pb−free package. Pricing is US$1.70 per unit in 10,000 unit quantities.




ENTERPRISE

Fiorano SOA seamlessly integrates cloud applications and core trading platforms at UK’s leading technology provider for Financial Services
June 10, 2010


Fiorano Software, pioneer in peer-to-peer distributed integration, announced that its highly scalable SOA Platform has been deployed by SSP UK, a leading technology provider to the top global insurance and financial services companies, with over 50,000 users across 50 countries.

SSP had a complex infrastructure with Managed Services and back-end software solutions, highly secure 24x7 data center operations and a mixture of hardware and software architecture.

Starting with an evaluation of IBM, Oracle, Microsoft and Fiorano as well as an option to develop in-house, SSP finally selected Fiorano. SSP’s decision criteria to standardize on the Fiorano SOA Platform Architecture was two-fold: (1) Fiorano ESB’s ability to rapidly integrate cloud-based applications (including salesforce.com) and extensive data with SSP’s API layer, ensuring integrity of back end data and its availability in real-time; and (2) Ease of integrating their extensive and complex supply chain involving customers, brokers and insurance companies. In both criteria, Fiorano emerged as a clear winner in SSP’s evaluation process.

MeeGo gains Industry Momentum
June 10, 2010


Intel and Nokia have released version 1.0 of the MeeGo Core Software Platform and the MeeGo Netbook User Experience. This release provides developers with a stable core foundation for application development and a rich user experience for Netbooks.

The MeeGo Netbook User Experience highlights include building on the latest open source technologies, instant access to synchronized calendar, tasks, appointments, recently used files and real-time social networking updates through the home screen and aggregation of social networking content which allows the user to see their social networking activities on one screen, easily interact with friends, and update status and site information.

In addition, multiple operating system vendors (OSVs), original equipment manufacturers (OEMs) and telecommunications companies used Computex as a backdrop to announce MeeGo and Intel AppUp Centre support which include:

Acer Backs MeeGo – Acer endorsed the MeeGo project and announced plans to launch MeeGo-based netbooks in 2010.

ASUS Supports Intel AppUp Centre and MeeGo – ASUS announced plans to launch the ASUS App Store, powered by the Intel AppUp Centre, in 2010 and ship MeeGo-based devices in 2011.

MeeGo Tablet Demos – Intel displayed MeeGo-based tablet designs from Inventec and Quanta at Computex. These technology demonstrations showed how easily users can access applications through the Intel AppUp Centre beta.

MeeGo v1.0-Based Products – Multiple OSVs announced MeeGo v1.0-based operating systems for netbooks, tablets and other devices.

Service Providers Rally Around MeeGo – In addition to the OSV product announcements above, telecommunications companies also have announced support of MeeGo on Internet-connected TVs and other devices.

MeeGo Enabling Centre – The Moblin Enabling Centre in Taiwan will be renamed as the MeeGo Enabling Centre. Also, MEC announced Info Launcher, a touch-based UI for MeeGo mobile computing devices based on service-oriented UI technology.



 

 

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